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Investigation of durability of TSV Interconnect by Numerical Thermal fatigue analysis

Title 
Investigation of durability of TSV Interconnect by Numerical Thermal fatigue analysis
Authors 
Haeng Soo, Lee
Authors 
Sung Hoon, Choa.; Cha Gyu, Song
Keywords 
hrough silicon via, Via filling material, Thermal fatigue, Durability
Issue Date 
2011
Publisher 
springer
Journal 
International journal of precision engineering and manufacturing
Vol. 
12
Issue 
4
Pages 
589-596
URI 
http://dx.doi.org/10.1007/s12541-011-0076-x
http://repository.uc.ac.kr/handle/2014.oak/459
ISSN 
1229-8557
Appears in Collections
04. 기계공학부 > 연구논문

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